AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-033-2288 (010332288) |
| NCB Code | USA (01) |
| Manufacturer | Intersil Communications Inc, Northrop Grumman Systems Corporation, Raytheon E Systems Inc, Sierra Ic Inc, Harris Corporation, Drs Network And Imaging Systems Llc, Intersil Corporation |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| CD40103BF 3 | intersil communications inc | microcircuit memory | RFQ |
| 134693-1 | northrop grumman systems corporation | microcircuit memory | RFQ |
| MC-A1103-001 | raytheon e systems inc | microcircuit memory | RFQ |
| 3512 830 06831 | sierra ic inc | microcircuit memory | RFQ |
| CD40103BD | harris corporation | microcircuit memory | RFQ |
| 232 53-1918 | drs network and imaging systems llc | microcircuit memory | RFQ |
| CD40103BF 3A | intersil communications inc | microcircuit memory | RFQ |
| CD40103BF 3 | intersil corporation | microcircuit memory | RFQ |
| CD40103BF 3A | intersil corporation | microcircuit memory | RFQ |
| CD40103BD 3 | intersil corporation | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | COUNTERMEASURES SET TYPE AN/ALQ-17A FSCM 72314 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED AND ASYNCHRONOUS AND PRESETTABLE AND SYNCHRONOUS AND W/ENABLE AND W/CLEAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 STAGE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.5 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-033-2288, 5962010332288 | ||||
| 5930-01-024-7616 (5930010247616) | 5935-01-207-1630 (5935012071630) | 5930-00-522-3346 (5930005223346) | 5985-01-615-6045 (5985016156045) | |
| 5910-00-805-1017 (5910008051017) | 5962-01-297-8133 (5962012978133) | 5935-01-108-9409 (5935011089409) | 5910-01-082-8261 (5910010828261) | |
| 5930-01-681-7491 (5930016817491) | 5930-01-322-8532 (5930013228532) | 5935-00-755-3452 (5935007553452) | 5985-01-676-2667 (5985016762667) | |
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