Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-033-2288 (010332288) |
NCB Code | USA (01) |
Manufacturer | Sierra Ic Inc, Intersil Corporation, Intersil Communications Inc, Raytheon E Systems Inc, Northrop Grumman Systems Corporation, Harris Corporation, Drs Network And Imaging Systems Llc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
3512 830 06831 | sierra ic inc | microcircuit memory | RFQ |
CD40103BF 3A | intersil corporation | microcircuit memory | RFQ |
CD40103BF 3A | intersil communications inc | microcircuit memory | RFQ |
CD40103BF 3 | intersil corporation | microcircuit memory | RFQ |
MC-A1103-001 | raytheon e systems inc | microcircuit memory | RFQ |
134693-1 | northrop grumman systems corporation | microcircuit memory | RFQ |
CD40103BD 3 | intersil corporation | microcircuit memory | RFQ |
CD40103BD | harris corporation | microcircuit memory | RFQ |
232 53-1918 | drs network and imaging systems llc | microcircuit memory | RFQ |
CD40103BF 3 | intersil communications inc | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | COUNTERMEASURES SET TYPE AN/ALQ-17A FSCM 72314 |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED AND ASYNCHRONOUS AND PRESETTABLE AND SYNCHRONOUS AND W/ENABLE AND W/CLEAR |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 8 STAGE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.5 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
Relevant Components for NSN - 5962-01-033-2288, 5962010332288 | ||||
5999-01-196-8879 (5999011968879) | 5970-00-488-9670 (5970004889670) | 5945-01-477-0491 (5945014770491) | 5999-01-364-2930 (5999013642930) | |
5996-01-452-4386 (5996014524386) | 5945-00-260-1626 (5945002601626) | 5998-01-130-0814 (5998011300814) | 5905-00-557-4486 (5905005574486) | |
5935-01-689-9407 (5935016899407) | 5980-01-504-2998 (5980015042998) | 5935-00-644-6464 (5935006446464) | 5995-01-277-3853 (5995012773853) | |
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