AS9120B, ISO 9001:2015, and FAA AC 0056B Accredited
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-278-7239 (012787239) |
| NCB Code | USA (01) |
| Manufacturer | Texas Instruments Inc, Raytheon Company |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| SMJ2532-45JM | texas instruments inc | microcircuit memory | RFQ |
| SMJ2532-45JDM | texas instruments inc | microcircuit memory | RFQ |
| 316-2548-001 | raytheon company | microcircuit memory | RFQ |
| TMS2532-45JL | texas instruments inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT" |
| CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
| CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND MONOLITHIC AND ERASABLE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT" |
| CRHL | UNABLE TO DECODE | UNABLE TO DECODE" |
| CSWJ | UNABLE TO DECODE | UNABLE TO DECODE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
| CZER | MEMORY DEVICE TYPE | ROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| Relevant Components for NSN - 5962-01-278-7239, 5962012787239 | ||||
| 5940-00-259-8375 (5940002598375) | 5995-01-500-8494 (5995015008494) | 5915-00-238-2959 (5915002382959) | 5962-01-580-0456 (5962015800456) | |
| 5980-01-461-5201 (5980014615201) | 5905-01-429-8929 (5905014298929) | 5930-00-247-7660 (5930002477660) | 5975-00-056-1646 (5975000561646) | |
| 5930-01-226-0441 (5930012260441) | 5999-01-708-8001 (5999017088001) | 5995-01-434-2653 (5995014342653) | 5905-01-102-5489 (5905011025489) | |
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