Thank you for taking an interest in the Semiconductor Device Diode NSN parts that we carry here on Buy Military Ground Vehicle Parts. You have reached the RFQ page for part number UPS840, an item that traces back to the manufacturer Microsemi Corporation. Listed with NSN 5961016036861, this listing is available for purchase from our website at any time. If you are interested in part number UPS840 and wish to learn more, be sure to fill out and submit the RFQ form found on this page. By presenting us information such as your target price and expected delivery date, we can best formulate and present a solution that closely caters to your unique needs and restrictions alike.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-603-6861 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 016036861 | N | A | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
A | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
UPS840 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CTQN | Voltage Rating In Volts Per Characteristic | 40.0 NOMINAL NOMINAL REGULATOR VOLTAGE |
AKPV | Mounting Facility Quantity | 3 |
AXGY | Mounting Method | TERMINAL |
ABKW | Overall Height | 0.040 INCHES NOMINAL |
MRC | Decoded Requirement | Clear Text Reply |
ABHP | Overall Length | 0.256 INCHES NOMINAL |
ABJT | Terminal Length | 0.027 INCHES NOMINAL AND 0.056 INCHES NOMINAL |
ABMK | Overall Width | 0.160 INCHES NOMINAL |
ABBH | Inclosure Material | PLASTIC |
FEAT | Special Features | LOW PROFILE-MAXIMUM HEIGHT OF 1.1MM;FOOTPRINT AREA OF 16.51 MM SQUARED;LOW THERMAL TESISTANCE WITH DIRECT THERMAL PATH ON DIE ON EXPOSED CATHODE HEAT SINK;CASE IS MOLDED EPOXY |
TTQY | Terminal Type And Quantity | 3 TAB, SOLDER LUG |
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